WO2023166875A1 - スピーカー振動板の製造方法、スピーカー振動板、及びスピーカー - Google Patents

スピーカー振動板の製造方法、スピーカー振動板、及びスピーカー Download PDF

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Publication number
WO2023166875A1
WO2023166875A1 PCT/JP2023/001389 JP2023001389W WO2023166875A1 WO 2023166875 A1 WO2023166875 A1 WO 2023166875A1 JP 2023001389 W JP2023001389 W JP 2023001389W WO 2023166875 A1 WO2023166875 A1 WO 2023166875A1
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WO
WIPO (PCT)
Prior art keywords
hole
speaker diaphragm
mold
manufacturing
conductive layer
Prior art date
Application number
PCT/JP2023/001389
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English (en)
French (fr)
Japanese (ja)
Inventor
和幸 稲垣
和志 黒柳
Original Assignee
株式会社Ｊｖｃケンウッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｊｖｃケンウッド filed Critical 株式会社Ｊｖｃケンウッド
Priority to JP2024504394A priority Critical patent/JP7700953B2/ja
Publication of WO2023166875A1 publication Critical patent/WO2023166875A1/ja
Priority to US18/791,742 priority patent/US20240422492A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/122—Non-planar diaphragms or cones comprising a plurality of sections or layers
    • H04R7/125—Non-planar diaphragms or cones comprising a plurality of sections or layers comprising a plurality of superposed layers in contact
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025—Diaphragms comprising polymeric materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/027—Diaphragms comprising metallic materials

Definitions

  • the present invention relates to a speaker diaphragm manufacturing method, a speaker diaphragm, and a speaker.
  • a manufacturing technology has been developed in which a tinsel cord is passed through the speaker diaphragm.
  • a tinsel cord is inserted through a through hole provided in a damper with respect to a speaker diaphragm made of metal.
  • the connecting portion between the tinsel wire and the voice coil is arranged on the outer peripheral surface of the voice coil bobbin.
  • the present invention has been made in view of such circumstances, and a method for manufacturing a speaker diaphragm that can ensure insulation and rigidity even if a hole is made in the speaker diaphragm, a speaker diaphragm, and The purpose is to provide speakers.
  • the method for manufacturing a speaker diaphragm includes: a conductive layer; A method for manufacturing a speaker diaphragm, comprising resin layers arranged to sandwich the conductive layer, a first step of providing a through hole for passing a tinsel wire through the conductive layer; The resin layers are arranged on both surfaces of the conductive layer by closing the molds in which a convex punch having a diameter smaller than the diameter of the through hole is provided in each of the first mold and the second mold.
  • a second step in which the punch presses the resin layer inside the through hole against the laminate In the second step, the leaking thickness of the resin layer is caused to flow in the direction of the inner surface of the through-hole by pressing the punch, and flow into the gap near the outer surface of the punch. is.
  • the method for manufacturing a speaker diaphragm according to the present embodiment can form a diaphragm that can ensure insulation and rigidity even if holes are made.
  • the method for manufacturing a speaker diaphragm includes: a conductive layer; A method for manufacturing a speaker diaphragm, comprising resin layers arranged to sandwich the conductive layer, a first step of providing a through hole for passing a tinsel wire through the conductive layer; By closing the molds each having a recess having a diameter larger than the diameter of the through hole in each of the first mold and the second mold, a laminate having the resin layer disposed on both surfaces of the conductive layer is formed.
  • a second step of pressing the resin layer outside the through hole A third step of pressurizing the space formed by the second step by combining the recesses of the mold, In the third step, the resin layer is pressurized and fused inside the through hole.
  • the speaker diaphragm In the method of manufacturing the speaker diaphragm according to this embodiment, it is not necessary to match the positions of the holes drilled in advance in the conductive material with the mold, so it is easy to ensure insulation and rigidity.
  • the speaker diaphragm according to this embodiment is A speaker diaphragm having a through hole for inserting a tinsel wire, a conductive layer having the through hole; Having a resin layer sandwiching from both sides of the conductive layer and covering the inner surface of the through hole, A portion of the resin layer covering the inner surface of the through hole is the resin that was positioned near the center of the through hole before the pressing step of pressing the resin layer from both sides of the conductive layer toward the center of the through hole. A part of the layer is formed by flowing in the inner surface direction of the through-hole by the pressing step.
  • the speaker diaphragm according to this embodiment can ensure insulation and rigidity even with holes.
  • the speaker according to this embodiment has the speaker diaphragm described above.
  • the speaker according to this embodiment can ensure insulation and rigidity even with holes.
  • a speaker diaphragm manufacturing method a speaker diaphragm, and a speaker that can ensure insulation and rigidity even if a hole is made in the diaphragm.
  • FIG. 1 is a perspective view of a speaker diaphragm 10 molded using the method for manufacturing a speaker diaphragm according to the first embodiment
  • FIG. FIG. 2 is a cross-sectional view of tinsel holes 11 in curved surface 101 of speaker diaphragm 10 formed using the method for manufacturing a speaker diaphragm according to the first embodiment.
  • FIG. 3 is a schematic diagram of a mold used in the method of manufacturing the speaker diaphragm according to the first embodiment; FIG.
  • FIG. 3 is a schematic diagram of a mold used in the method of manufacturing the speaker diaphragm according to the first embodiment
  • 4 is a flow chart showing a method for manufacturing a speaker diaphragm according to the first embodiment
  • It is the figure which showed the manufacturing method of the speaker diaphragm which concerns on 1st Embodiment.
  • 3 is an enlarged view of a mold 30 in the method for manufacturing a speaker diaphragm according to the first embodiment
  • FIG. FIG. 4 is an enlarged view when a punch P presses a resin layer 22 inside a through-hole 31 by the method of manufacturing a speaker diaphragm according to the first embodiment
  • FIG. 11 is an enlarged view of the punch P pressing the resin layer 22 inside the through-hole 31 by the method of manufacturing the speaker diaphragm according to the second embodiment; It is an enlarged view of the manufacturing method of the speaker diaphragm according to the third embodiment.
  • FIG. 10 is a cross-sectional view of the tinsel hole 11 in the curved surface 101 of the speaker diaphragm 10 molded using the method for manufacturing the speaker diaphragm according to the third embodiment. It is an enlarged view of the manufacturing method of the speaker diaphragm according to the fourth embodiment. It is an enlarged view of the manufacturing method of the speaker diaphragm according to the fifth embodiment.
  • FIG. 1 is a perspective view of a speaker diaphragm 10 formed using the speaker diaphragm manufacturing method according to the first embodiment.
  • the speaker diaphragm 10 has a curved surface 101 , an edge portion 102 and a tinsel hole 11 .
  • the curved surface 101 has a concave shape from the outer periphery toward the center.
  • the curved surface 101 is provided with a hollow hole 13 in the center of the curved surface 101 and a tinsel thread hole 11 on the curved surface 101 .
  • the tinsel wire 12 is passed through the tinsel wire hole 11. - ⁇ In FIG. 1, there are four tinsel holes 11, but the number of tinsel holes is not limited to four, and may be two.
  • the edge portion 102 is provided outside so as to follow the outer periphery of the curved surface 101 on a plane perpendicular to the normal direction passing through the center of the hole 13 .
  • the curved surface 101 of the speaker diaphragm 10 vibrates with the edge portion 102 as a fixed end.
  • a field of view seen from a direction perpendicular to the normal direction of the hollow hole 13 of the speaker diaphragm 10 is referred to as a cross-sectional view.
  • FIG. 2 is a cross-sectional view passing through the tinsel hole 11 in the curved surface 101 of the speaker diaphragm 10 formed using the method for manufacturing the speaker diaphragm according to the first embodiment.
  • the speaker diaphragm 10 according to the first embodiment has a conductive layer 21 and a resin layer 22 .
  • the resin layers 22 are arranged so as to sandwich the conductive layer 21 and are fused with the fused surfaces 200 . That is, the resin layer 22 in the speaker diaphragm 10 according to the first embodiment is arranged so as to wrap the conductive layer 21 .
  • a laminate in which the resin layers 22 are arranged on both sides of the conductive layer 21 is referred to as a laminate M1.
  • the resin layer 22 is, for example, a 5, 10, or 15 ⁇ m polypropylene sheet. Moreover, the thickness of the speaker diaphragm 10 is preferably 200 ⁇ m or less, or 100 ⁇ m or less.
  • the conductive layer 21 conducts electricity because it is a conductor, but the resin layer 22 does not conduct electricity because it is a nonconductor. In the speaker diaphragm molded by the manufacturing method of the speaker diaphragm according to the first embodiment, even if the tinsel wire is passed through the tinsel wire hole 11, only the resin layer 22 is in contact with the tinsel wire. , do not short.
  • FIGS. 3 and 4 are schematic diagrams of a mold used in the method of manufacturing the speaker diaphragm according to the first embodiment.
  • a mold 30 used in the method of manufacturing the speaker diaphragm according to the first embodiment will be described with reference to FIGS. 3 and 4.
  • FIG. 3 the mold 30 has a pair of movable molds 301 and 302 that can be opened and closed.
  • the movable dies 301 and 302 in FIG. 3 are movable in a direction parallel to the Z-axis.
  • the movable mold 301 and the movable mold 302 are provided with a convex punch P. As shown in FIG.
  • the punch P is provided line-symmetrically with respect to a center line parallel to the movable direction of the movable mold 301 and the movable mold 302 .
  • the diameter of the punch P is a shape smaller than the diameter of the through-hole 31 mentioned later.
  • the punch P may be provided only on one side with respect to the center line parallel to the movable direction of the movable dies 301 and 302 .
  • the laminate M1 is placed in the mold 30.
  • the through hole 31 of the speaker diaphragm 10 is arranged so as to be pressed by the punch P of the mold 30 . Since FIG. 3 is a cross-sectional view of the speaker diaphragm 10, the through hole 31 is not shown. As shown in FIG.
  • the laminate M1 is pressed. Then, the pair of movable molds 301 and 302 are opened, and the molded laminate M2 is taken out.
  • One of the movable molds 301 and 302 may be a fixed mold. Further, the movable mold 301 is called a first mold, and the movable mold 302 is called a second mold. The movable mold 301 may be the second mold, and the movable mold 302 may be the first mold. The movable mold 301 and the movable mold 302 in FIG. 4 omit the punch P for convenience of explanation.
  • FIG. 5 is a flow chart showing the method of manufacturing the speaker diaphragm according to the first embodiment.
  • FIG. 6 is a schematic diagram showing a method of manufacturing the speaker diaphragm according to the first embodiment. Note that the tinsel hole 11 of the speaker diaphragm in FIG. 6 is two examples. Steps ST1 to ST3 and steps ST6 to ST7 in FIG. 6 are top views of the speaker diaphragm 10, while steps ST4 and ST5 are cross-sectional views of the speaker diaphragm 10. FIG.
  • the conductive layer 21 is prepared (step ST1). At this time, the conductive layer 21 in FIG. 6 has a substantially square shape, but it may have a circular shape.
  • a through hole 31 having a diameter larger than that of the tinsel wire is provided in the conductive layer 21 (step ST2).
  • the through hole 31 is formed by, for example, a punch tool, cutting, or the like.
  • the resin layers 22 are placed so as to sandwich the conductive layer 21 to form the laminate M1 (step ST3).
  • the resin layer 22 in FIG. 6 has a substantially square shape, it may have a circular shape.
  • the conductive layer 21 and the resin layer 22 have the same shape.
  • the laminate M1 prepared in step ST3 is placed in the mold 30 (step ST4).
  • the through hole 31 of the speaker diaphragm 10 is arranged so as to be pressed by the punch P of the mold 30 . It is pressed by closing the movable molds 301 and 302 (step ST5).
  • the shaped laminate M2 is taken out (step ST6), the tinsel thread holes 11 are formed inside the through holes 31 in the laminate M2, and the holes 13 are formed in the laminate M2.
  • the speaker diaphragm 10 is obtained by cutting the laminate M2 into a circular shape according to the outer shape of the speaker diaphragm (step ST7).
  • the diameter of the tinsel thread hole 11 is a hole smaller than the diameter of the through hole 31 .
  • FIG. 7 is an enlarged view of the mold 30 in the speaker diaphragm manufacturing method according to the first embodiment. 7 is an enlarged view corresponding to 110 portion of the mold 30 shown in FIG. Steps ST4 and ST5 will be described in detail below.
  • a laminate M1 composed of the conductive layer 21 and the resin layer 22 is placed in the mold 30 .
  • the laminate M1 and the mold 30 are arranged so that the center of the through hole 31 provided in the conductive layer 21 and the center of the punch P provided in the mold 30 are aligned (step ST4).
  • the laminate M1 is sandwiched and pressed between the movable dies 301 and 302 (step ST5).
  • the movable mold 301 is provided with a convex punch P. Therefore, the punch P presses the resin layer 22 inside the through hole 31 .
  • the distance in the vertical direction (Z-axis direction) between the punch P of the movable mold 301 and the punch P of the movable mold 302 at the time of completion of pressing is smaller than the thickness of the two resin layers 22 (thickness in the Z-axis direction). is set. In this manner, the punch P strongly fuses the upper and lower resin layers 22 together.
  • the outside of the through-hole 31, that is, the resin layer 22 sandwiching the conductive layer 21 is pressed by the metal mold 30 and becomes thinner. At this time, the resin layer 22 protrudes into the conductive layer 21 and the thickness of the resin layer 22 is slightly reduced.
  • FIG. 8 is an enlarged view when the punch P presses the resin layer 22 inside the through hole 31 by the method for manufacturing the speaker diaphragm according to the first embodiment.
  • a portion of the through hole 31 in FIG. 8 is omitted for convenience of explanation.
  • a punch P presses the resin layer 22 .
  • the diameter of the punch P is smaller than the diameter 31L of the through hole 31 . That is, as shown in FIG. 8, the punch P and the conductive layer 21 are separated by a distance L1 in the horizontal direction (x direction).
  • the laminated body M1 existing in the vicinity of the punch P has two layers, a step is formed with respect to the three-layer portion, and a gap portion near the outer surface of the punch P is generated by the thickness difference near the base of the punch P. . Therefore, when the punch P presses the resin layer 22 inside the through hole 31 , the resin layer 22 flows toward the inner side surface of the through hole 31 and flows into the gap near the outer side surface of the punch P.
  • the resin layer 22 flowing at this time is referred to as a leakage thickness 40 .
  • the leakage thickness 40 is generated by the method for manufacturing the speaker diaphragm according to the first embodiment, so that the conductive layer 21 is wrapped with the resin layer 22 .
  • the thickness of the two-layer portion without the conductive layer 21 near the through hole 31 can be made the same as that of the three-layer portion of the laminate M1, so that the rigidity of the opening can be increased.
  • the step of providing the through hole 31 for passing the tinsel wire through the conductive layer 21 is called the first step.
  • a step of pressing the resin layer 22 with the punch P inside the through hole 31 against the laminate M1 by closing the mold 30 having the convex punch P having a diameter smaller than the diameter of the through hole 31. is called the second step.
  • the speaker diaphragm has a conductive layer 21 having a through-hole for inserting a tinsel wire, and a resin layer 22 sandwiching the conductive layer 21 from both sides and covering the inner surface of the through-hole.
  • a part of the resin layer 22 covering the inner surface of the through-hole is the resin layer that was positioned near the center of the through-hole before the pressing step of pressing the resin layer 22 from both sides of the conductive layer 21 near the center of the through-hole.
  • a part of 22 is formed by flowing in the inner surface direction of the through-hole by the pressing process.
  • FIG. 9 is an enlarged view when the punch P presses the resin layer 22 inside the through hole 31 by the method for manufacturing the speaker diaphragm according to the second embodiment. A part of the through hole 31 in FIG. 9 is omitted for convenience of explanation. Since the mold 30 according to the second embodiment is the same as the method for manufacturing the speaker diaphragm according to the first embodiment, description thereof is omitted. Here, the decompression tube 60 will be described.
  • the decompression tube 60 is provided in a cavity in the mold 30 through which the leaking thickness 40 flows, that is, a cavity between the mold 30 and the laminate M1.
  • the decompression tube 60 is connected to, for example, a decompression pump (not shown).
  • a combination of the decompression tube 60 and the decompression pump is called a decompression device.
  • the decompression device is not limited to a combination of a decompression tube and a decompression pump, and may be a pipe and a decompression pump or a pipe and a vacuum pump.
  • the decompression device guides the leaking meat 40 to flow in the direction of the inner surface of the through hole 31 .
  • the step of inducing the leaking meat 40 to flow in the direction of the inner side surface of the through hole 31 is called the decompression step.
  • the leaked thickness caused by punching is induced to flow, so that the degree of adhesion between the resin layer and the mold is increased, and the insulation and rigidity are improved. is easier to secure.
  • FIG. 10 is an enlarged view of the method for manufacturing the speaker diaphragm according to the third embodiment. A portion of the through hole 31 in FIG. 10 is omitted for convenience of explanation. Since the mold 30 according to the third embodiment is the same as the method for manufacturing the speaker diaphragm according to the first embodiment, description thereof is omitted. Here, the partition mold 70 will be described.
  • the partition mold 70 is provided in each of the first mold and the second mold in the vicinity of the inner surface of the through hole 31 .
  • the partition die 70 prevents the leaking thickness 40 from moving toward the inner side surface of the through hole 31 in the gap near the outer side surface of the punch P.
  • the leaked thickness 40 flows in the direction of the inner side surface of the through hole 31 and moves to the gap near the outer side surface of the punch P.
  • the presence of the partition die 70 prevents the leaked thickness 40 from moving toward the inner side surface of the through hole 31 in the gap near the outer side surface of the punch P.
  • FIG. 11 is a cross-sectional view passing through the tinsel hole 11 in the curved surface 101 of the speaker diaphragm 10 molded using the method for manufacturing the speaker diaphragm according to the third embodiment.
  • the resin layer 22 is arranged so as to wrap the conductive layer 21 and is fused to the fusion bonding surface 700 .
  • a concave groove 701 is formed on the front and back surfaces of the curved surface 101 by a partition die 70 .
  • the leaked thickness generated by punching can be reliably guided to an assumed position, so that the area of the fused surface is increased, and insulation and rigidity are ensured. easier to do.
  • FIG. 12 is an enlarged view of the method for manufacturing the speaker diaphragm according to the fourth embodiment.
  • the method for manufacturing a speaker diaphragm according to the fourth embodiment differs from the method for manufacturing a speaker diaphragm according to the first embodiment in steps ST4 and ST5.
  • Steps ST04 and ST05 in FIG. 12 correspond to steps ST4 and ST5 in FIG.
  • the mold 80 and steps ST04 and ST05 will be described.
  • the mold 80 has a pair of movable molds 801 and 802 that can be opened and closed.
  • the movable mold 801 and the movable mold 802 partially have a recess having a predetermined length in the movable direction.
  • the movable direction is the vertical direction (Z-axis direction).
  • the diameter of the recess in movable mold 801 and movable mold 802 is larger than the diameter of through hole 31 .
  • One of the movable molds 801 and 802 may be a fixed mold.
  • the movable mold 801 is called a first mold
  • the movable mold 802 is called a second mold.
  • the movable mold 801 may be the second mold
  • the movable mold 802 may be the first mold.
  • the laminate M1 is placed on the movable mold 801 and the movable mold 802 (step ST04).
  • the resin layer 22 is pressed outside the through hole 31 .
  • the dents of the dies are combined to form a space S1.
  • the pressurizing device 81 is inserted into the space S1 to pressurize the resin layer 22 inside the through hole 31 (step ST05).
  • the resin layer 22 inside the through hole 31 is compressed in the direction of the through hole 31 and fused.
  • the pair of movable molds 801 and 802 are opened, and the molded laminate M2 is taken out.
  • the pressurizing device 81 is, for example, a pressurizing device combining an air gun or a pressurizing tube with a pressurizing pump, or a pressurizing device combining an air gun and a compressor.
  • the step of providing the through hole 31 for passing the tinsel wire through the conductive layer 21 is called the first step.
  • the step of pressing the resin layer 22 on the outside of the through hole 31 against the laminate M1 by closing the mold 80 having a recess having a diameter larger than that of the through hole 31 is referred to as the second step. called.
  • the step of pressurizing the space formed by the dents of the mold 80 in the second step is referred to as the third step.
  • FIG. 13 is an enlarged view of the method for manufacturing the speaker diaphragm according to the fifth embodiment.
  • the method for manufacturing a speaker diaphragm according to the fifth embodiment differs from the method for manufacturing a speaker diaphragm according to the first embodiment in steps ST4 and ST5.
  • Steps ST004 and ST005 in FIG. 13 correspond to steps ST4 and ST5 in FIG.
  • the mold 91, the decompression tube 90, and steps ST004 and ST005 will be described.
  • a vacuum tube 90 is inserted into the conductive layer 21 .
  • the decompression tube 90 is connected to, for example, a decompression pump (not shown).
  • a combination of the decompression tube 90 and the decompression pump is called a decompression device.
  • the decompression device is not limited to a combination of a decompression tube and a decompression pump, and may be a pipe and a decompression pump or a pipe and a vacuum pump. Since the conductive layer 21 has air permeability, it is decompressed by the decompression device. In conjunction with this, the resin layer 22 inside the through hole 31 is compressed in the direction of the through hole 31 and fused.
  • the mold 91 has a pair of movable molds 911 and 912 that can be opened and closed.
  • the movable die 911 and the movable die 912 may have any shape as long as they are flat outside the through hole 31 .
  • the mold 91 may be provided with a partition mold 70 .
  • One of the movable molds 911 and 912 may be a fixed mold.
  • the conductive layer 21 is decompressed by the decompression device.
  • the conductive layer 21 may be depressurized by another mold 30 while depressurizing the cavity where the leaking meat 40 occurs by another depressurizing device.
  • the pressure reduction of the conductive layer 21 may be performed simultaneously with the pressurization by the pressurizing device 81 while pressing with another mold 80 .
  • the laminate M1 is placed on the movable mold 911 and the movable mold 912 (step ST004).
  • the laminate M1 is pressed.
  • the pressure of the conductive layer 21 is reduced by the decompression device (step ST005).
  • the resin layer 22 inside the through hole 31 is compressed in the direction of the through hole 31 and fused.
  • the pair of movable molds 911 and 912 are opened, and the molded laminate M2 is taken out.
  • the step of decompressing the conductive layer 21 and fusing the resin layer 22 inside the through hole 31 is called a decompression step.
  • a speaker diaphragm manufactured using the method for manufacturing a speaker diaphragm according to Embodiments 1 to 5 described above and a speaker using the speaker diaphragm can ensure insulation and rigidity.
  • the present invention can be used, for example, in speaker devices and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
PCT/JP2023/001389 2022-03-03 2023-01-18 スピーカー振動板の製造方法、スピーカー振動板、及びスピーカー WO2023166875A1 (ja)

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JP2024504394A JP7700953B2 (ja) 2022-03-03 2023-01-18 スピーカー振動板の製造方法、スピーカー振動板、及びスピーカー
US18/791,742 US20240422492A1 (en) 2022-03-03 2024-08-01 Method of manufacturing speaker diaphragm, speaker diaphragm, and speaker

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JP2022-032480 2022-03-03
JP2022032480 2022-03-03

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US18/791,742 Continuation US20240422492A1 (en) 2022-03-03 2024-08-01 Method of manufacturing speaker diaphragm, speaker diaphragm, and speaker

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Citations (6)

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Publication number Priority date Publication date Assignee Title
JPS6135497U (ja) * 1984-08-02 1986-03-04 オンキヨー株式会社 スピ−カ
JPS6482800A (en) * 1987-09-24 1989-03-28 Sanon Kk Manufacture of diaphragm for speaker
JPH0286299A (ja) * 1988-09-21 1990-03-27 Pioneer Electron Corp スピーカ用振動板
WO2007135745A1 (ja) * 2006-05-24 2007-11-29 Pioneer Corporation スピーカ装置
WO2014162472A1 (ja) * 2013-04-01 2014-10-09 パイオニア株式会社 振動板及びスピーカ装置
WO2016170595A1 (ja) * 2015-04-21 2016-10-27 賢太 田中 電気音響変換装置

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